Nozzle arrangement for an inkjet printhead chip that incorporates a nozzle chamber reduction mechanism

ABSTRACT

A nozzle arrangement for an inkjet printer includes a wafer assembly defining a nozzle chamber into which ink can be fed. A nozzle chamber roof assembly is fast with the wafer assembly and covers the nozzle chamber. The nozzle chamber roof assembly defines an ink ejection port supported by a plurality of outwardly extending bridging members, and a plurality of cantilevered actuators interleaved between the bridging members and extending inwardly to terminate in free ends proximal to the ink ejection port. An elongate heater element extends through each actuator so that, in use, the heater element causes differential thermal expansion in the actuators and thus the free ends of the actuators subsequently to move into the nozzle chamber and force ink therein out through the ink ejection port.

CROSS REFERENCES TO RELATED APPLICATIONS

This application is a continuation application of U.S. application Ser. No. 11/026,136 filed Jan. 3, 2005, now issued U.S. Pat. No. 7,188,933, which is a continuation application of U.S. application Ser. No. 10/309,036 filed Dec. 4, 2002, now issued U.S. Pat. No. 7,284,833, which is a Continuation Application of U.S. application Ser. No. 09/855,093 filed May 14, 2001, now issued U.S. Pat. No. 6,505,912, which is a Continuation Application of U.S. application Ser. No. 09/112,806 filed Jul. 10, 1998, now issued U.S. Pat. No. 6,247,790 all of which are herein incorporated by reference.

The following Australian provisional patent applications are hereby incorporated by cross-reference. For the purposes of location and identification, US patents/patent applications identified by their US patent/patent application serial numbers are listed alongside the Australian applications from which the US patents/patent applications claim the right of priority.

U.S. Pat. No./PATENT CROSS-REFERENCED APPLICATION (CLAIMING AUSTRALIAN RIGHT OF PRIORITY PROVISIONAL PATENT FROM AUSTRALIAN APPLICATION NO. PROVISIONAL APPLICATION) PO9395 6322181 PO8017 6597817 PO8014 6227648 PO8025 6727948 PO8032 6690419 PO7999 6727951 PO8030 6196541 PO7997 6195150 PO7979 6362868 PO7978 6831681 PO7982 6431669 PO7989 6362869 PO8019 6472052 PO7980 6356715 PO8018 6894694 PO7938 6636216 PO8016 6366693 PO8024 6329990 PO7939 6459495 PO8501 6137500 PO8500 6690416 PO7987 7050143 PO8022 6398328 PO8497 7110024 PO8020 6431704 PO8504 6879341 PO8000 6415054 PO7934 6665454 PO7990 6542645 PO8499 6486886 PO8502 6381361 PO7981 6317192 PO7986 6850274 PO7983 09/113054 PO8026 6646757 PO8028 6624848 PO9394 6357135 PO9397 6271931 PO9398 6353772 PO9399 6106147 PO9400 6665008 PO9401 6304291 PO9403 6305770 PO9405 6289262 PP0959 6315200 PP1397 6217165 PP2370 6786420 PO8003 6350023 PO8005 6318849 PO8066 6227652 PO8072 6213588 PO8040 6213589 PO8071 6231163 PO8047 6247795 PO8035 6394581 PO8044 6244691 PO8063 6257704 PO8057 6416168 PO8056 6220694 PO8069 6257705 PO8049 6247794 PO8036 6234610 PO8048 6247793 PO8070 6264306 PO8067 6241342 PO8001 6247792 PO8038 6264307 PO8033 6254220 PO8002 6234611 PO8068 6302528 PO8062 6283582 PO8034 6239821 PO8039 6338547 PO8041 6247796 PO8004 6557977 PO8037 6390603 PO8043 6362843 PO8042 6293653 PO8064 6312107 PO9389 6227653 PO9391 6234609 PP0888 6238040 PP0891 6188415 PP0890 6227654 PP0873 6209989 PP0993 6247791 PP0890 6336710 PP1398 6217153 PP2592 6416167 PP2593 6243113 PP3991 6283581 PP3987 6247790 PP3985 6260953 PP3983 6267469 PO7935 6224780 PO7936 6235212 PO7937 6280643 PO8061 6284147 PO8054 6214244 PO8065 6071750 PO8055 6267905 PO8053 6251298 PO8078 6258285 PO7933 6225138 PO7950 6241904 PO7949 6299786 PO8060 6866789 PO8059 6231773 PO8073 6190931 PO8076 6248249 PO8075 6290862 PO8079 6241906 PO8050 6565762 PO8052 6241905 PO7948 6451216 PO7951 6231772 PO8074 6274056 PO7941 6290861 PO8077 6248248 PO8058 6306671 PO8051 6331258 PO8045 6110754 PO7952 6294101 PO8046 6416679 PO9390 6264849 PO9392 6254793 PP0889 6235211 PP0887 6491833 PP0882 6264850 PP0874 6258284 PP1396 6312615 PP3989 6228668 PP2591 6180427 PP3990 6171875 PP3986 6267904 PP3984 6245247 PP3982 6315914 PP0895 6231148 PP0869 6293658 PP0887 6614560 PP0885 6238033 PP0884 6312070 PP0886 6238111 PP0877 6378970 PP0878 6196739 PP0883 6270182 PP0880 6152619 PO8006 6087638 PO8007 6340222 PO8010 6041600 PO8011 6299300 PO7947 6067797 PO7944 6286935 PO7946 6044646 PP0894 6382769

STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT

Not applicable.

FIELD OF THE INVENTION

The present invention relates to the field of fluid ejection and, in particular, discloses a fluid ejection chip.

BACKGROUND OF THE INVENTION

Many different types of printing mechanisms have been invented, a large number of which are presently in use. The known forms of printers have a variety of methods for marking the print media with a relevant marking media. Commonly used forms of printing include offset printing, laser printing and copying devices, dot matrix type impact printers, thermal paper printers, film recorders, thermal wax printers, dye sublimation printers and ink jet printers both of the drop on demand and continuous flow type. Each type of printer has its own advantages and problems when considering cost, speed, quality, reliability, simplicity of construction and operation etc.

In recent years the field of ink jet printing, wherein each individual pixel of ink is derived from one or more ink nozzles, has become increasingly popular primarily due to its inexpensive and versatile nature.

Many different techniques of ink jet printing have been invented. For a survey of the field, reference is made to an article by J Moore, “Non-Impact Printing: Introduction and Historical Perspective”, Output Hard Copy Devices, Editors R Dubeck and S Sherr, pages 207-220 (1988).

Ink Jet printers themselves come in many different forms. The utilization of a continuous stream of ink in ink jet printing appears to date back to at least 1929 wherein U.S. Pat. No. 1,941,001 by Hansell discloses a simple form of continuous stream electro-static ink jet printing.

U.S. Pat. No. 3,596,275 by Sweet also discloses a process of a continuous ink jet printing including a step wherein the ink jet stream is modulated by a high frequency electro-static field so as to cause drop separation. This technique is still utilized by several manufacturers including Elmjet and Scitex (see also U.S. Pat. No. 3,373,437 by Sweet et al).

Piezoelectric ink jet printers are also one form of commonly utilized ink jet printing device. Piezoelectric systems are disclosed by Kyser et. al. in U.S. Pat. No. 3,946,398 (1970) which utilizes a diaphragm mode of operation, by Zolten in U.S. Pat. No. 3,683,212 (1970) which discloses a squeeze mode form of operation of a piezoelectric crystal, Stemme in U.S. Pat. No. 3,747,120 (1972) which discloses a bend mode of piezoelectric operation, Howkins in U.S. Pat. No. 4,459,601 which discloses a piezoelectric push mode actuation of the ink jet stream and Fischbeck in U.S. Pat. No. 4,584,590 which discloses a shear mode type of piezoelectric transducer element.

Recently, thermal ink jet printing has become an extremely popular form of ink jet printing. The ink jet printing techniques include those disclosed by Endo et al in GB 2007162 (1979) and Vaught et al in U.S. Pat. No. 4,490,728. Both the aforementioned references disclose ink jet printing techniques which rely on the activation of an electrothermal actuator which results in the creation of a bubble in a constricted space, such as a nozzle, which thereby causes the ejection of ink from an aperture connected to the confined space onto a relevant print media. Manufacturers such as Canon and Hewlett Packard manufacture printing devices utilizing the electro-thermal actuator.

As can be seen from the foregoing, many different types of printing technologies are available. Ideally, a printing technology should have a number of desirable attributes. These include inexpensive construction and operation, high-speed operation, safe and continuous long-term operation etc. Each technology may have its own advantages and disadvantages in the areas of cost, speed, quality, reliability, power usage, simplicity of construction and operation, durability and consumables.

Applicant has developed a substantial amount of technology in the field of micro-electromechanical inkjet printing. The parent application is indeed directed to a particular aspect in this field. In this application, the Applicant has applied the technology to the more general field of fluid ejection.

SUMMARY OF THE INVENTION

In accordance with a first aspect of the present invention, there is provided a nozzle arrangement for an ink jet printhead, the arrangement comprising a nozzle chamber defined in a wafer substrate for the storage of ink to be ejected; an ink ejection port having a rim formed on one wall of the chamber; and a series of actuators attached to the wafer substrate, and forming a portion of the wall of the nozzle chamber adjacent the rim, the actuator paddles further being actuated in unison so as to eject ink from the nozzle chamber via the ink ejection nozzle.

The actuators can include a surface which bends inwards away from the center of the nozzle chamber upon actuation. The actuators are preferably actuated by means of a thermal actuator device. The thermal actuator device may comprise a conductive resistive heating element encased within a material having a high coefficient of thermal expansion. The element can be serpentine to allow for substantially unhindered expansion of the material. The actuators are preferably arranged radially around the nozzle rim.

The actuators can form a membrane between the nozzle chamber and an external atmosphere of the arrangement and the actuators bend away from the external atmosphere to cause an increase in pressure within the nozzle chamber thereby initiating a consequential ejection of ink from the nozzle chamber. The actuators can bend away from a central axis of the nozzle chamber.

The nozzle arrangement can be formed on the wafer substrate utilizing micro-electro mechanical techniques and further can comprise an ink supply channel in communication with the nozzle chamber. The ink supply channel may be etched through the wafer. The nozzle arrangement may include a series of struts which support the nozzle rim.

The arrangement can be formed adjacent to neighbouring arrangements so as to form a pagewidth printhead.

In this application, the invention extends to a fluid ejection chip that comprises

a substrate; and

a plurality of nozzle arrangements positioned on the substrate, each nozzle arrangement comprising

-   -   a nozzle chamber defining structure which defines a nozzle         chamber and which includes a wall in which a fluid ejection port         is defined; and     -   at least one actuator for ejecting fluid from the nozzle chamber         through the fluid ejection port, the, or each, actuator being         displaceable with respect to the substrate on receipt of an         electrical signal, wherein     -   the, or each, actuator is formed in said wall of the nozzle         chamber defining structure, so that displacement of the, or         each, actuator results in a change in volume of the nozzle         chamber so that fluid is ejected from the fluid ejection port.

Each nozzle arrangement may include a plurality of actuators, each actuator including an actuating portion and a paddle positioned on the actuating portion, the actuating portion being anchored to the substrate and being displaceable on receipt of an electrical signal to displace the paddle, in turn, the paddles and the wall being substantially coplanar and the actuating portions being configured so that, upon receipt of said electrical signal, the actuating portions displace the paddles into the nozzle chamber to reduce a volume of the nozzle chamber, thereby ejecting fluid from the fluid ejection port.

A periphery of each paddle may be shaped to define a fluidic seal when the nozzle chamber is filled with fluid.

BRIEF DESCRIPTION OF THE DRAWINGS

Notwithstanding any other forms which may fall within the scope of the present invention, preferred forms of the invention will now be described, by way of example only, with reference to the accompanying drawings in which:

FIGS. 1-3 are schematic sectional views illustrating the operational principles of the preferred embodiment;

FIG. 4( a) and FIG. 4( b) are again schematic sections illustrating the operational principles of the thermal actuator device;

FIG. 5 is a side perspective view, partly in section, of a single nozzle arrangement constructed in accordance with the preferred embodiments;

FIGS. 6-13 are side perspective views, partly in section, illustrating the manufacturing steps of the preferred embodiments;

FIG. 14 illustrates an array of ink jet nozzles formed in accordance with the manufacturing procedures of the preferred embodiment;

FIG. 15 provides a legend of the materials indicated in FIGS. 16 to 23; and

FIG. 16 to FIG. 23 illustrate sectional views of the manufacturing steps in one form of construction of a nozzle arrangement in accordance with the invention.

DESCRIPTION OF PREFERRED AND OTHER EMBODIMENTS

In the following description, reference is made to the ejection of ink for application to ink jet printing. However, it will readily be appreciated that the present application can be applied to any situation where fluid ejection is required.

In the preferred embodiment, ink is ejected out of a nozzle chamber via an ink ejection port using a series of radially positioned thermal actuator devices that are arranged about the ink ejection port and are activated to pressurize the ink within the nozzle chamber thereby causing the ejection of ink through the ejection port.

Turning now to FIGS. 1, 2 and 3, there is illustrated the basic operational principles of the preferred embodiment. FIG. 1 illustrates a single nozzle arrangement 1 in its quiescent state. The arrangement 1 includes a nozzle chamber 2 which is normally filled with ink so as to form a meniscus 3 in an ink ejection port 4. The nozzle chamber 2 is formed within a wafer 5. The nozzle chamber 2 is supplied with ink via an ink supply channel 6 which is etched through the wafer 5 with a highly isotropic plasma etching system. A suitable etcher can be the Advance Silicon Etch (ASE) system available from Surface Technology Systems of the United Kingdom.

A top of the nozzle arrangement 1 includes a series of radially positioned actuators 8, 9. These actuators comprise a polytetrafluoroethylene (PTFE) layer and an internal serpentine copper core 17. Upon heating of the copper core 17, the surrounding PTFE expands rapidly resulting in a generally downward movement of the actuators 8, 9. Hence, when it is desired to eject ink from the ink ejection port 4, a current is passed through the actuators 8, 9 which results in them bending generally downwards as illustrated in FIG. 2. The downward bending movement of the actuators 8, 9 results in a substantial increase in pressure within the nozzle chamber 2. The increase in pressure in the nozzle chamber 2 results in an expansion of the meniscus 3 as illustrated in FIG. 2.

The actuators 8, 9 are activated only briefly and subsequently deactivated. Consequently, the situation is as illustrated in FIG. 3 with the actuators 8, 9 returning to their original positions. This results in a general inflow of ink back into the nozzle chamber 2 and a necking and breaking of the meniscus 3 resulting in the ejection of a drop 12. The necking and breaking of the meniscus 3 is a consequence of the forward momentum of the ink associated with drop 12 and the backward pressure experienced as a result of the return of the actuators 8, 9 to their original positions. The return of the actuators 8,9 also results in a general inflow of ink from the channel 6 as a result of surface tension effects and, eventually, the state returns to the quiescent position as illustrated in FIG. 1.

FIGS. 4( a) and 4(b) illustrate the principle of operation of the thermal actuator. The thermal actuator is preferably constructed from a material 14 having a high coefficient of thermal expansion. Embedded within the material 14 are a series of heater elements 15 which can be a series of conductive elements designed to carry a current. The conductive elements 15 are heated by passing a current through the elements 15 with the heating resulting in a general increase in temperature in the area around the heating elements 15. The position of the elements 15 is such that uneven heating of the material 14 occurs. The uneven increase in temperature causes a corresponding uneven expansion of the material 14. Hence, as illustrated in FIG. 4( b), the PTFE is bent generally in the direction shown.

In FIG. 5, there is illustrated a side perspective view of one embodiment of a nozzle arrangement constructed in accordance with the principles previously outlined. The nozzle chamber 2 is formed with an isotropic surface etch of the wafer 5. The wafer 5 can include a CMOS layer including all the required power and drive circuits. Further, the actuators 8, 9 each have a leaf or petal formation which extends towards a nozzle rim 28 defining the ejection port 4. The normally inner end of each leaf or petal formation is displaceable with respect to the nozzle rim 28. Each activator 8, 9 has an internal copper core 17 defining the element 15. The core 17 winds in a serpentine manner to provide for substantially unhindered expansion of the actuators 8, 9. The operation of the actuators 8, 9 is as illustrated in FIG. 4( a) and FIG. 4( b) such that, upon activation, the actuators 8 bend as previously described resulting in a displacement of each petal formation away from the nozzle rim 28 and into the nozzle chamber 2. The ink supply channel 6 can be created via a deep silicon back edge of the wafer 5 utilizing a plasma etcher or the like. The copper or aluminum core 17 can provide a complete circuit. A central arm 18 which can include both metal and PTFE portions provides the main structural support for the actuators 8, 9.

Turning now to FIG. 6 to FIG. 13, one form of manufacture of the nozzle arrangement 1 in accordance with the principles of the preferred embodiment is shown. The nozzle arrangement 1 is preferably manufactured using micro-electromechanical (MEMS) techniques and can include the following construction techniques:

As shown initially in FIG. 6, the initial processing starting material is a standard semi-conductor wafer 20 having a complete CMOS level 21 to a first level of metal. The first level of metal includes portions 22 which are utilized for providing power to the thermal actuators 8, 9.

The first step, as illustrated in FIG. 7, is to etch a nozzle region down to the silicon wafer 20 utilizing an appropriate mask.

Next, as illustrated in FIG. 8, a 2 μm layer of polytetrafluoroethylene (PTFE) is deposited and etched so as to define vias 24 for interconnecting multiple levels.

Next, as illustrated in FIG. 9, the second level metal layer is deposited, masked and etched to define a heater structure 25. The heater structure 25 includes via 26 interconnected with a lower aluminum layer.

Next, as illustrated in FIG. 10, a further 2 μm layer of PTFE is deposited and etched to the depth of 1 μm utilizing a nozzle rim mask to define the nozzle rim 28 in addition to ink flow guide rails 29 which generally restrain any wicking along the surface of the PTFE layer. The guide rails 29 surround small thin slots and, as such, surface tension effects are a lot higher around these slots which in turn results in minimal outflow of ink during operation.

Next, as illustrated in FIG. 11, the PTFE is etched utilizing a nozzle and actuator mask to define a port portion 30 and slots 31 and 32.

Next, as illustrated in FIG. 12, the wafer is crystallographically etched on a <111> plane utilizing a standard crystallographic etchant such as KOH. The etching forms a chamber 33, directly below the port portion 30.

In FIG. 13, the ink supply channel 34 can be etched from the back of the wafer utilizing a highly anisotropic etcher such as the STS etcher from Silicon Technology Systems of United Kingdom. An array of ink jet nozzles can be formed simultaneously with a portion of an array 36 being illustrated in FIG. 14. A portion of the printhead is formed simultaneously and diced by the STS etching process. The array 36 shown provides for four column printing with each separate column attached to a different color ink supply channel being supplied from the back of the wafer. Bond pads 37 provide for electrical control of the ejection mechanism.

In this manner, large pagewidth printheads can be fabricated so as to provide for a drop-on-demand ink ejection mechanism.

One form of detailed manufacturing process which can be used to fabricate monolithic ink jet printheads operating in accordance with the principles taught by the present embodiment can proceed utilizing the following steps:

1. Using a double-sided polished wafer 60, complete a 0.5 micron, one poly, 2 metal CMOS process 61. This step shown in FIG. 16. For clarity, these diagrams may not be to scale, and may not represent a cross section though any single plane of the nozzle. FIG. 15 is a key to representations of various materials in these manufacturing diagrams, and those of other cross-referenced ink jet configurations.

2. Etch the CMOS oxide layers down to silicon or second level metal using Mask 1. This mask defines the nozzle cavity and the edge of the chips. This step is shown in FIG. 16.

3. Deposit a thin layer (not shown) of a hydrophilic polymer, and treat the surface of this polymer for PTFE adherence.

4. Deposit 1.5 microns of polytetrafluoroethylene (PTFE) 62.

5. Etch the PTFE and CMOS oxide layers to second level metal using Mask 2. This mask defines the contact vias for the heater electrodes. This step is shown in FIG. 17.

6. Deposit and pattern 0.5 microns of gold 63 using a lift-off process using Mask 3. This mask defines the heater pattern. This step is shown in FIG. 18.

7. Deposit 1.5 microns of PTFE 64.

8. Etch 1 micron of PTFE using Mask 4. This mask defines the nozzle rim 65 and the rim at the edge 66 of the nozzle chamber. This step is shown in FIG. 19.

9. Etch both layers of PTFE and the thin hydrophilic layer down to silicon using Mask 5. This mask defines a gap 67 at inner edges of the actuators, and the edge of the chips. It also forms the mask for a subsequent crystallographic etch. This step is shown in FIG. 20.

10. Crystallographically etch the exposed silicon using KOH. This etch stops on <111> crystallographic planes 68, forming an inverted square pyramid with sidewall angles of 54.74 degrees. This step is shown in FIG. 21.

11. Back-etch through the silicon wafer (with, for example, an ASE Advanced Silicon Etcher from Surface Technology Systems) using Mask 6. This mask defines the ink inlets 69 which are etched through the wafer. The wafer is also diced by this etch. This step is shown in FIG. 22.

12. Mount the printheads in their packaging, which may be a molded plastic former incorporating ink channels which supply the appropriate color ink to the ink inlets 69 at the back of the wafer.

13. Connect the printheads to their interconnect systems. For a low profile connection with minimum disruption of airflow, TAB may be used. Wire bonding may also be used if the printer is to be operated with sufficient clearance to the paper.

14. Fill the completed print heads with ink 70 and test them. A filled nozzle is shown in FIG. 23.

The presently disclosed ink jet printing technology is potentially suited to a wide range of printing systems including: color and monochrome office printers, short run digital printers, high speed digital printers, offset press supplemental printers, low cost scanning printers high speed pagewidth printers, notebook computers with inbuilt pagewidth printers, portable color and monochrome printers, color and monochrome copiers, color and monochrome facsimile machines, combined printer, facsimile and copying machines, label printers, large format plotters, photograph copiers, printers for digital photographic “minilabs”, video printers, PHOTO CD (PHOTO CD is a registered trade mark of the Eastman Kodak Company) printers, portable printers for PDAs, wallpaper printers, indoor sign printers, billboard printers, fabric printers, camera printers and fault tolerant commercial printer arrays.

It would be appreciated by a person skilled in the art that numerous variations and/or modifications may be made to the present invention as shown in the specific embodiments without departing from the spirit or scope of the invention as broadly described. The present embodiments are, therefore, to be considered in all respects to be illustrative and not restrictive.

Ink Jet Technologies

The embodiments of the invention use an ink jet printer type device. Of course many different devices could be used. However, presently popular inkjet printing technologies are unlikely to be suitable.

The most significant problem with thermal ink jet is power consumption. This is approximately 100 times that required for high speed, and stems from the energy-inefficient means of drop ejection. This involves the rapid boiling of water to produce a vapor bubble which expels the ink. Water has a very high heat capacity, and must be superheated in thermal ink jet applications. This leads to an efficiency of around 0.02%, from electricity input to drop momentum (and increased surface area) out.

The most significant problem with piezoelectric ink jet is size and cost. Piezoelectric crystals have a very small deflection at reasonable drive voltages, and therefore require a large area for each nozzle. Also, each piezoelectric actuator must be connected to its drive circuit on a separate substrate. This is not a significant problem at the current limit of around 300 nozzles per printhead, but is a major impediment to the fabrication of pagewidth printheads with 19,200 nozzles.

Ideally, the ink jet technologies used meet the stringent requirements of in-camera digital color printing and other high quality, high speed, low cost printing applications. To meet the requirements of digital photography, new ink jet technologies have been created. The target features include:

low power (less than 10 Watts)

High-resolution capability (1,600 dpi or more)

photographic quality output

low manufacturing cost

small size (pagewidth times minimum cross section)

high speed (<2 seconds per page).

All of these features can be met or exceeded by the ink jet systems described below with differing levels of difficulty. Forty-five different ink jet technologies have been developed by the Assignee to give a wide range of choices for high volume manufacture. These technologies form part of separate applications assigned to the present Assignee as set out in the table below under the heading Cross References to Related Applications.

The ink jet designs shown here are suitable for a wide range of digital printing systems, from battery powered one-time use digital cameras, through to desktop and network printers, and through to commercial printing systems.

For ease of manufacture using standard process equipment, the printhead is designed to be a monolithic 0.5-micron CMOS chip with MEMS post processing. For color photographic applications, the printhead is 100 mm long, with a width which depends upon the ink jet type. The smallest printhead designed is IJ38, which is 0.35 mm wide, giving a chip area of 35 square mm. The printheads each contain 19,200 nozzles plus data and control circuitry.

Ink is supplied to the back of the printhead by injection molded plastic ink channels. The molding requires 50 micron features, which can be created using a lithographically micromachined insert in a standard injection molding tool. Ink flows through holes etched through the wafer to the nozzle chambers fabricated on the front surface of the wafer. The printhead is connected to the camera circuitry by tape automated bonding.

Tables of Drop-on-Demand Ink Jets

Eleven important characteristics of the fundamental operation of individual ink jet nozzles have been identified. These characteristics are largely orthogonal, and so can be elucidated as an eleven dimensional matrix. Most of the eleven axes of this matrix include entries developed by the present assignee.

The following tables form the axes of an eleven dimensional table of ink jet types.

Actuator mechanism (18 types)

Basic operation mode (7 types)

Auxiliary mechanism (8 types)

Actuator amplification or modification method (17 types)

Actuator motion (19 types)

Nozzle refill method (4 types)

Method of restricting back-flow through inlet (10 types)

Nozzle clearing method (9 types)

Nozzle plate construction (9 types)

Drop ejection direction (5 types)

Ink type (7 types)

The complete eleven dimensional table represented by these axes contains 36.9 billion possible configurations of ink jet nozzle. While not all of the possible combinations result in a viable ink jet technology, many million configurations are viable. It is clearly impractical to elucidate all of the possible configurations. Instead, certain ink jet types have been investigated in detail. These are designated IJ01 to IJ45 above which matches the docket numbers in the table under the heading Cross References to Related Applications.

Other ink jet configurations can readily be derived from these forty-five examples by substituting alternative configurations along one or more of the 11 axes. Most of the IJ01 to IJ45 examples can be made into ink jet printheads with characteristics superior to any currently available ink jet technology.

Where there are prior art examples known to the inventor, one or more of these examples are listed in the examples column of the tables below. The IJ01 to IJ45 series are also listed in the examples column. In some cases, print technology may be listed more than once in a table, where it shares characteristics with more than one entry.

Suitable applications for the ink jet technologies include: Home printers, Office network printers, Short run digital printers, Commercial print systems, Fabric printers, Pocket printers, Internet WWW printers, Video printers, Medical imaging, Wide format printers, Notebook PC printers, Fax machines, Industrial printing systems, Photocopiers, Photographic minilabs etc.

The information associated with the aforementioned 11 dimensional matrix is set out in the following tables.

ACTUATOR MECHANISM (APPLIED ONLY TO SELECTED INK DROPS) Description Advantages Disadvantages Examples Thermal An electrothermal Large force High power Canon Bubblejet bubble heater heats the ink to generated Ink carrier limited to 1979 Endo et al GB above boiling point, Simple construction water patent 2,007,162 transferring significant No moving parts Low efficiency Xerox heater-in-pit heat to the aqueous Fast operation High temperatures 1990 Hawkins et al ink. A bubble Small chip area required U.S. Pat. No. 4,899,181 nucleates and quickly required for actuator High mechanical Hewlett-Packard TIJ forms, expelling the stress 1982 Vaught et al ink. Unusual materials U.S. Pat. No. 4,490,728 The efficiency of the required process is low, with Large drive typically less than transistors 0.05% of the electrical Cavitation causes energy being actuator failure transformed into Kogation reduces kinetic energy of the bubble formation drop. Large print heads are difficult to fabricate Piezoelectric A piezoelectric crystal Low power Very large area Kyser et al U.S. Pat. No. such as lead consumption required for actuator 3,946,398 lanthanum zirconate Many ink types can Difficult to integrate Zoltan U.S. Pat. No. (PZT) is electrically be used with electronics 3,683,212 activated, and either Fast operation High voltage drive 1973 Stemme U.S. Pat. No. expands, shears, or High efficiency transistors required 3,747,120 bends to apply Full pagewidth print Epson Stylus pressure to the ink, heads impractical Tektronix ejecting drops. due to actuator size IJ04 Requires electrical poling in high field strengths during manufacture Electrostrictive An electric field is Low power Low maximum Seiko Epson, Usui used to activate consumption strain (approx. et all JP 253401/96 electrostriction in Many ink types can 0.01%) IJ04 relaxor materials such be used Large area required as lead lanthanum Low thermal for actuator due to zirconate titanate expansion low strain (PLZT) or lead Electric field Response speed is magnesium niobate strength required marginal (~10 μs) (PMN). (approx. 3.5 V/μm) High voltage drive can be generated transistors required without difficulty Full pagewidth print Does not require heads impractical electrical poling due to actuator size Ferroelectric An electric field is Low power Difficult to integrate IJ04 used to induce a phase consumption with electronics transition between the Many ink types can Unusual materials antiferroelectric (AFE) be used such as PLZSnT are and ferroelectric (FE) Fast operation required phase. Perovskite (<1 μs) Actuators require a materials such as tin Relatively high large area modified lead longitudinal strain lanthanum zirconate High efficiency titanate (PLZSnT) Electric field exhibit large strains of strength of around 3 V/μm up to 1% associated can be readily with the AFE to FE provided phase transition. Electrostatic Conductive plates are Low power Difficult to operate IJ02, IJ04 plates separated by a consumption electrostatic devices compressible or fluid Many ink types can in an aqueous dielectric (usually air). be used environment Upon application of a Fast operation The electrostatic voltage, the plates actuator will attract each other and normally need to be displace ink, causing separated from the drop ejection. The ink conductive plates may Very large area be in a comb or required to achieve honeycomb structure, high forces or stacked to increase High voltage drive the surface area and transistors may be therefore the force. required Full pagewidth print heads are not competitive due to actuator size Electrostatic A strong electric field Low current High voltage 1989 Saito et al, pull is applied to the ink, consumption required U.S. Pat. No. 4,799,068 on ink whereupon Low temperature May be damaged by 1989 Miura et al, electrostatic attraction sparks due to air U.S. Pat. No. 4,810,954 accelerates the ink breakdown Tone-jet towards the print Required field medium. strength increases as the drop size decreases High voltage drive transistors required Electrostatic field attracts dust Permanent An electromagnet Low power Complex fabrication IJ07, IJ10 magnet directly attracts a consumption Permanent magnetic electromagnetic permanent magnet, Many ink types can material such as displacing ink and be used Neodymium Iron causing drop ejection. Fast operation Boron (NdFeB) Rare earth magnets High efficiency required. with a field strength Easy extension from High local currents around 1 Tesla can be single nozzles to required used. Examples are: pagewidth print Copper metalization Samarium Cobalt heads should be used for (SaCo) and magnetic long materials in the electromigration neodymium iron boron lifetime and low family (NdFeB, resistivity NdDyFeBNb, Pigmented inks are NdDyFeB, etc) usually infeasible Operating temperature limited to the Curie temperature (around 540 K) Soft A solenoid induced a Low power Complex fabrication IJ01, IJ05, IJ08, magnetic magnetic field in a soft consumption Materials not IJ10, IJ12, IJ14, core electromagnetic magnetic core or yoke Many ink types can usually present in a IJ15, IJ17 fabricated from a be used CMOS fab such as ferrous material such Fast operation NiFe, CoNiFe, or as electroplated iron High efficiency CoFe are required alloys such as CoNiFe Easy extension from High local currents [1], CoFe, or NiFe single nozzles to required alloys. Typically, the pagewidth print Copper metalization soft magnetic material heads should be used for is in two parts, which long are normally held electromigration apart by a spring. lifetime and low When the solenoid is resistivity actuated, the two parts Electroplating is attract, displacing the required ink. High saturation flux density is required (2.0-2.1 T is achievable with CoNiFe [1]) Lorenz The Lorenz force Low power Force acts as a IJ06, IJ11, IJ13, force acting on a current consumption twisting motion IJ16 carrying wire in a Many ink types can Typically, only a magnetic field is be used quarter of the utilized. Fast operation solenoid length This allows the High efficiency provides force in a magnetic field to be Easy extension from useful direction supplied externally to single nozzles to High local currents the print head, for pagewidth print required example with rare heads Copper metalization earth permanent should be used for magnets. long Only the current electromigration carrying wire need be lifetime and low fabricated on the print resistivity head, simplifying Pigmented inks are materials usually infeasible requirements. Magnetostriction The actuator uses the Many ink types can Force acts as a Fischenbeck, U.S. Pat. No. giant magnetostrictive be used twisting motion 4,032,929 effect of materials Fast operation Unusual materials IJ25 such as Terfenol-D (an Easy extension from such as Terfenol-D alloy of terbium, single nozzles to are required dysprosium and iron pagewidth print High local currents developed at the Naval heads required Ordnance Laboratory, High force is Copper metalization hence Ter-Fe-NOL). available should be used for For best efficiency, the long actuator should be pre- electromigration stressed to approx. 8 MPa. lifetime and low resistivity Pre-stressing may be required Surface Ink under positive Low power Requires Silverbrook, EP tension pressure is held in a consumption supplementary force 0771 658 A2 and reduction nozzle by surface Simple construction to effect drop related patent tension. The surface No unusual separation applications tension of the ink is materials required in Requires special ink reduced below the fabrication surfactants bubble threshold, High efficiency Speed may be causing the ink to Easy extension from limited by surfactant egress from the single nozzles to properties nozzle. pagewidth print heads Viscosity The ink viscosity is Simple construction Requires Silverbrook, EP reduction locally reduced to No unusual supplementary force 0771 658 A2 and select which drops are materials required in to effect drop related patent to be ejected. A fabrication separation applications viscosity reduction can Easy extension from Requires special ink be achieved single nozzles to viscosity properties electrothermally with pagewidth print High speed is most inks, but special heads difficult to achieve inks can be engineered Requires oscillating for a 100:1 viscosity ink pressure reduction. A high temperature difference (typically 80 degrees) is required Acoustic An acoustic wave is Can operate without Complex drive 1993 Hadimioglu et generated and a nozzle plate circuitry al, EUP 550,192 focussed upon the Complex fabrication 1993 Elrod et al, drop ejection region. Low efficiency EUP 572,220 Poor control of drop position Poor control of drop volume Thermoelastic An actuator which Low power Efficient aqueous IJ03, IJ09, IJ17, bend relies upon differential consumption operation requires a IJ18, IJ19, IJ20, actuator thermal expansion Many ink types can thermal insulator on IJ21, IJ22, IJ23, upon Joule heating is be used the hot side IJ24, IJ27, IJ28, used. Simple planar Corrosion IJ29, IJ30, IJ31, fabrication prevention can be IJ32, IJ33, IJ34, Small chip area difficult IJ35, IJ36, IJ37, required for each Pigmented inks may IJ38, IJ39, IJ40, actuator be infeasible, as IJ41 Fast operation pigment particles High efficiency may jam the bend CMOS compatible actuator voltages and currents Standard MEMS processes can be used Easy extension from single nozzles to pagewidth print heads High CTE A material with a very High force can be Requires special IJ09, IJ17, IJ18, thermoelastic high coefficient of generated material (e.g. PTFE) IJ20, IJ21, IJ22, actuator thermal expansion Three methods of Requires a PTFE IJ23, IJ24, IJ27, (CTE) such as PTFE deposition are deposition process, IJ28, IJ29, IJ30, polytetrafluoroethylene under development: which is not yet IJ31, IJ42, IJ43, (PTFE) is used. As chemical vapor standard in ULSI IJ44 high CTE materials deposition (CVD), fabs are usually non- spin coating, and PTFE deposition conductive, a heater evaporation cannot be followed fabricated from a PTFE is a candidate with high conductive material is for low dielectric temperature (above incorporated. A 50 μm constant insulation 350° C.) processing long PTFE bend in ULSI Pigmented inks may actuator with Very low power be infeasible, as polysilicon heater and consumption pigment particles 15 mW power input Many ink types can may jam the bend can provide 180 μN be used actuator force and 10 μm Simple planar deflection. Actuator fabrication motions include: Small chip area Bend required for each actuator Push Fast operation Buckle High efficiency Rotate CMOS compatible voltages and currents Easy extension from single nozzles to pagewidth print heads Conductive A polymer with a high High force can be Requires special IJ24 polymer coefficient of thermal generated materials thermoelastic expansion (such as Very low power development (High actuator PTFE) is doped with consumption CTE conductive conducting substances Many ink types can polymer) to increase its be used Requires a PTFE conductivity to about 3 Simple planar deposition process, orders of magnitude fabrication which is not yet below that of copper. Small chip area standard in ULSI The conducting required for each fabs polymer expands actuator PTFE deposition when resistively Fast operation cannot be followed heated. High efficiency with high Examples of CMOS compatible temperature (above conducting dopants voltages and 350° C.) processing include: currents Evaporation and Carbon nanotubes Easy extension from CVD deposition Metal fibers single nozzles to techniques cannot Conductive polymers pagewidth print be used such as doped heads Pigmented inks may polythiophene be infeasible, as Carbon granules pigment particles may jam the bend actuator Shape A shape memory alloy High force is Fatigue limits IJ26 memory such as TiNi (also available (stresses maximum number alloy known as Nitinol - of hundreds of MPa) of cycles Nickel Titanium alloy Large strain is Low strain (1%) is developed at the Naval available (more than required to extend Ordnance Laboratory) 3%) fatigue resistance is thermally switched High corrosion Cycle rate limited between its weak resistance by heat removal martensitic state and Simple construction Requires unusual its high stiffness Easy extension from materials (TiNi) austenitic state. The single nozzles to The latent heat of shape of the actuator pagewidth print heads transformation must in its martensitic state Low voltage operation be provided is deformed relative to High current operation the austenitic shape. Requires pre- The shape change stressing to distort causes ejection of a drop. the martensitic state Linear Linear magnetic Linear Magnetic Requires unusual IJ12 Magnetic actuators include the actuators can be semiconductor Actuator Linear Induction constructed with materials such as Actuator (LIA), Linear high thrust, long soft magnetic alloys Permanent Magnet travel, and high (e.g. CoNiFe) Synchronous Actuator efficiency using Some varieties also (LPMSA), Linear planar require permanent Reluctance semiconductor magnetic materials Synchronous Actuator fabrication such as Neodymium (LRSA), Linear techniques iron boron (NdFeB) Switched Reluctance Long actuator travel Requires complex Actuator (LSRA), and is available multi-phase drive the Linear Stepper Medium force is circuitry Actuator (LSA). available High current operation Low voltage operation

BASIC OPERATION MODE Description Advantages Disadvantages Examples Actuator This is the simplest Simple operation Drop repetition rate Thermal ink jet directly mode of operation: the No external fields is usually limited to Piezoelectric ink jet pushes ink actuator directly required around 10 kHz. IJ01, IJ02, IJ03, supplies sufficient Satellite drops can However, this is not IJ04, IJ05, IJ06, kinetic energy to expel be avoided if drop fundamental to the IJ07, IJ09, IJ11, the drop. The drop velocity is less than method, but is IJ12, IJ14, IJ16, must have a sufficient 4 m/s related to the refill IJ20, IJ22, IJ23, velocity to overcome Can be efficient, method normally IJ24, IJ25, IJ26, the surface tension. depending upon the used IJ27, IJ28, IJ29, actuator used All of the drop IJ30, IJ31, IJ32, kinetic energy must IJ33, IJ34, IJ35, be provided by the IJ36, IJ37, IJ38, actuator IJ39, IJ40, IJ41, Satellite drops IJ42, IJ43, IJ44 usually form if drop velocity is greater than 4.5 m/s Proximity The drops to be Very simple print Requires close Silverbrook, EP printed are selected by head fabrication can proximity between 0771 658 A2 and some manner (e.g. be used the print head and related patent thermally induced The drop selection the print media or applications surface tension means does not need transfer roller reduction of to provide the May require two pressurized ink). energy required to print heads printing Selected drops are separate the drop alternate rows of the separated from the ink from the nozzle image in the nozzle by Monolithic color contact with the print print heads are medium or a transfer difficult roller. Electrostatic The drops to be Very simple print Requires very high Silverbrook, EP pull printed are selected by head fabrication can electrostatic field 0771 658 A2 and on ink some manner (e.g. be used Electrostatic field related patent thermally induced The drop selection for small nozzle applications surface tension means does not need sizes is above air Tone-Jet reduction of to provide the breakdown pressurized ink). energy required to Electrostatic field Selected drops are separate the drop may attract dust separated from the ink from the nozzle in the nozzle by a strong electric field. Magnetic The drops to be Very simple print Requires magnetic Silverbrook, EP pull on ink printed are selected by head fabrication can ink 0771 658 A2 and some manner (e.g. be used Ink colors other than related patent thermally induced The drop selection black are difficult applications surface tension means does not need Requires very high reduction of to provide the magnetic fields pressurized ink). energy required to Selected drops are separate the drop separated from the ink from the nozzle in the nozzle by a strong magnetic field acting on the magnetic ink. Shutter The actuator moves a High speed (>50 kHz) Moving parts are IJ13, IJ17, IJ21 shutter to block ink operation can required flow to the nozzle. The be achieved due to Requires ink ink pressure is pulsed reduced refill time pressure modulator at a multiple of the Drop timing can be Friction and wear drop ejection very accurate must be considered frequency. The actuator energy Stiction is possible can be very low Shuttered The actuator moves a Actuators with Moving parts are IJ08, IJ15, IJ18, grill shutter to block ink small travel can be required IJ19 flow through a grill to used Requires ink the nozzle. The shutter Actuators with pressure modulator movement need only small force can be Friction and wear be equal to the width used must be considered of the grill holes. High speed (>50 kHz) Stiction is possible operation can be achieved Pulsed A pulsed magnetic Extremely low Requires an external IJ10 magnetic field attracts an ‘ink energy operation is pulsed magnetic pull on ink pusher’ at the drop possible field pusher ejection frequency. An No heat dissipation Requires special actuator controls a problems materials for both catch, which prevents the actuator and the the ink pusher from ink pusher moving when a drop is Complex not to be ejected. construction

AUXILIARY MECHANISM (APPLIED TO ALL NOZZLES) Description Advantages Disadvantages Examples None The actuator directly Simplicity of Drop ejection Most ink jets, fires the ink drop, and construction energy must be including there is no external Simplicity of supplied by piezoelectric and field or other operation individual nozzle thermal bubble. mechanism required. Small physical size actuator IJ01, IJ02, IJ03, IJ04, IJ05, IJ07, IJ09, IJ11, IJ12, IJ14, IJ20, IJ22, IJ23, IJ24, IJ25, IJ26, IJ27, IJ28, IJ29, IJ30, IJ31, IJ32, IJ33, IJ34, IJ35, IJ36, IJ37, IJ38, IJ39, IJ40, IJ41, IJ42, IJ43, IJ44 Oscillating The ink pressure Oscillating ink Requires external Silverbrook, EP ink pressure oscillates, providing pressure can provide ink pressure 0771 658 A2 and (including much of the drop a refill pulse, oscillator related patent acoustic ejection energy. The allowing higher Ink pressure phase applications stimulation) actuator selects which operating speed and amplitude must IJ08, IJ13, IJ15, drops are to be fired The actuators may be carefully IJ17, IJ18, IJ19, by selectively operate with much controlled IJ21 blocking or enabling lower energy Acoustic reflections nozzles. The ink Acoustic lenses can in the ink chamber pressure oscillation be used to focus the must be designed may be achieved by sound on the for vibrating the print nozzles head, or preferably by an actuator in the ink supply. Media The print head is Low power Precision assembly Silverbrook, EP proximity placed in close High accuracy required 0771 658 A2 and proximity to the print Simple print head Paper fibers may related patent medium. Selected construction cause problems applications drops protrude from Cannot print on the print head further rough substrates than unselected drops, and contact the print medium. The drop soaks into the medium fast enough to cause drop separation. Transfer Drops are printed to a High accuracy Bulky Silverbrook, EP roller transfer roller instead Wide range of print Expensive 0771 658 A2 and of straight to the print substrates can be Complex related patent medium. A transfer used construction applications roller can also be used Ink can be dried on Tektronix hot melt for proximity drop the transfer roller piezoelectric ink jet separation. Any of the IJ series Electrostatic An electric field is Low power Field strength Silverbrook, EP used to accelerate Simple print head required for 0771 658 A2 and selected drops towards construction separation of small related patent the print medium. drops is near or applications above air Tone-Jet breakdown Direct A magnetic field is Low power Requires magnetic Silverbrook, EP magnetic used to accelerate Simple print head ink 0771 658 A2 and field selected drops of construction Requires strong related patent magnetic ink towards magnetic field applications the print medium. Cross The print head is Does not require Requires external IJ06, IJ16 magnetic placed in a constant magnetic materials magnet field magnetic field. The to be integrated in Current densities Lorenz force in a the print head may be high, current carrying wire manufacturing resulting in is used to move the process electromigration actuator. problems Pulsed A pulsed magnetic Very low power Complex print head IJ10 magnetic field is used to operation is possible construction field cyclically attract a Small print head Magnetic materials paddle, which pushes size required in print on the ink. A small head actuator moves a catch, which selectively prevents the paddle from moving.

ACTUATOR AMPLIFICATION OR MODIFICATION METHOD Description Advantages Disadvantages Examples None No actuator Operational Many actuator Thermal Bubble Ink jet mechanical simplicity mechanisms have IJ01, IJ02, IJ06, amplification is used. insufficient travel, IJ07, IJ16, IJ25, The actuator directly or insufficient force, IJ26 drives the drop to efficiently drive ejection process. the drop ejection process Differential An actuator material Provides greater High stresses are Piezoelectric expansion expands more on one travel in a reduced involved IJ03, IJ09, IJ17, bend side than on the other. print head area Care must be taken IJ18, IJ19, IJ20, actuator The expansion may be that the materials do IJ21, IJ22, IJ23, thermal, piezoelectric, not delaminate IJ24, IJ27, IJ29, magnetostrictive, or Residual bend IJ30, IJ31, IJ32, other mechanism. The resulting from high IJ33, IJ34, IJ35, bend actuator converts temperature or high IJ36, IJ37, IJ38, a high force low travel stress during IJ39, IJ42, IJ43, actuator mechanism to formation IJ44 high travel, lower force mechanism. Transient A trilayer bend Very good High stresses are IJ40, IJ41 bend actuator where the two temperature stability involved actuator outside layers are High speed, as a Care must be taken identical. This cancels new drop can be that the materials do bend due to ambient fired before heat not delaminate temperature and dissipates residual stress. The Cancels residual actuator only responds stress of formation to transient heating of one side or the other. Reverse The actuator loads a Better coupling to Fabrication IJ05, IJ11 spring spring. When the the ink complexity actuator is turned off, High stress in the the spring releases. spring This can reverse the force/distance curve of the actuator to make it compatible with the force/time requirements of the drop ejection. Actuator A series of thin Increased travel Increased Some piezoelectric stack actuators are stacked. Reduced drive fabrication ink jets This can be voltage complexity IJ04 appropriate where Increased possibility actuators require high of short circuits due electric field strength, to pinholes such as electrostatic and piezoelectric actuators. Multiple Multiple smaller Increases the force Actuator forces may IJ12, IJ13, IJ18, actuators actuators are used available from an not add linearly, IJ20, IJ22, IJ28, simultaneously to actuator reducing efficiency IJ42, IJ43 move the ink. Each Multiple actuators actuator need provide can be positioned to only a portion of the control ink flow force required. accurately Linear A linear spring is used Matches low travel Requires print head IJ15 Spring to transform a motion actuator with higher area for the spring with small travel and travel requirements high force into a Non-contact method longer travel, lower of motion force motion. transformation Coiled A bend actuator is Increases travel Generally restricted IJ17, IJ21, IJ34, actuator coiled to provide Reduces chip area to planar IJ35 greater travel in a Planar implementations reduced chip area. implementations are due to extreme relatively easy to fabrication difficulty fabricate. in other orientations. Flexure A bend actuator has a Simple means of Care must be taken IJ10, IJ19, IJ33 bend small region near the increasing travel of not to exceed the actuator fixture point, which a bend actuator elastic limit in the flexes much more flexure area readily than the Stress distribution is remainder of the very uneven actuator. The actuator Difficult to flexing is effectively accurately model converted from an with finite element even coiling to an analysis angular bend, resulting in greater travel of the actuator tip. Catch The actuator controls a Very low actuator Complex IJ10 small catch. The catch energy construction either enables or Very small actuator Requires external disables movement of size force an ink pusher that is Unsuitable for controlled in a bulk pigmented inks manner. Gears Gears can be used to Low force, low Moving parts are IJ13 increase travel at the travel actuators can required expense of duration. be used Several actuator Circular gears, rack Can be fabricated cycles are required and pinion, ratchets, using standard More complex drive and other gearing surface MEMS electronics methods can be used. processes Complex construction Friction, friction, and wear are possible Buckle plate A buckle plate can be Very fast movement Must stay within S. Hirata et al, “An used to change a slow achievable elastic limits of the Ink-jet Head Using actuator into a fast materials for long Diaphragm motion. It can also device life Microactuator”, convert a high force, High stresses Proc. IEEE MEMS, low travel actuator involved February 1996, pp 418-423. into a high travel, Generally high IJ18, IJ27 medium force motion. power requirement Tapered A tapered magnetic Linearizes the Complex IJ14 magnetic pole can increase magnetic construction pole travel at the expense force/distance curve of force. Lever A lever and fulcrum is Matches low travel High stress around IJ32, IJ36, IJ37 used to transform a actuator with higher the fulcrum motion with small travel requirements travel and high force Fulcrum area has no into a motion with linear movement, longer travel and and can be used for lower force. The lever a fluid seal can also reverse the direction of travel. Rotary The actuator is High mechanical Complex IJ28 impeller connected to a rotary advantage construction impeller. A small The ratio of force to Unsuitable for angular deflection of travel of the actuator pigmented inks the actuator results in can be matched to a rotation of the the nozzle impeller vanes, which requirements by push the ink against varying the number stationary vanes and of impeller vanes out of the nozzle. Acoustic A refractive or No moving parts Large area required 1993 Hadimioglu et al, lens diffractive (e.g. zone Only relevant for EUP 550,192 plate) acoustic lens is acoustic ink jets 1993 Elrod et al, used to concentrate EUP 572,220 sound waves. Sharp A sharp point is used Simple construction Difficult to fabricate Tone-jet conductive to concentrate an using standard VLSI point electrostatic field. processes for a surface ejecting ink- jet Only relevant for electrostatic ink jets

ACTUATOR MOTION Description Advantages Disadvantages Examples Volume The volume of the Simple construction High energy is Hewlett-Packard expansion actuator changes, in the case of typically required to Thermal Ink jet pushing the ink in all thermal ink jet achieve volume Canon Bubblejet directions. expansion. This leads to thermal stress, cavitation, and kogation in thermal ink jet implementations Linear, The actuator moves in Efficient coupling to High fabrication IJ01, IJ02, IJ04, normal to a direction normal to ink drops ejected complexity may be IJ07, IJ11, IJ14 chip surface the print head surface. normal to the required to achieve The nozzle is typically surface perpendicular in the line of motion movement. Parallel to The actuator moves Suitable for planar Fabrication IJ12, IJ13, IJ15, chip surface parallel to the print fabrication complexity IJ33,, IJ34, IJ35, head surface. Drop Friction IJ36 ejection may still be Stiction normal to the surface. Membrane An actuator with a The effective area of Fabrication 1982 Howkins U.S. Pat. No. push high force but small the actuator complexity 4,459,601 area is used to push a becomes the Actuator size stiff membrane that is membrane area Difficulty of in contact with the ink. integration in a VLSI process Rotary The actuator causes Rotary levers may Device complexity IJ05, IJ08, IJ13, the rotation of some be used to increase May have friction at IJ28 element, such a grill or travel a pivot point impeller Small chip area requirements Bend The actuator bends A very small change Requires the 1970 Kyser et al when energized. This in dimensions can actuator to be made U.S. Pat. No. 3,946,398 may be due to be converted to a from at least two 1973 Stemme U.S. Pat. No. differential thermal large motion. distinct layers, or to 3,747,120 expansion, have a thermal IJ03, IJ09, IJ10, piezoelectric difference across the IJ19, IJ23, IJ24, expansion, actuator IJ25, IJ29, IJ30, magnetostriction, or IJ31, IJ33, IJ34, other form of relative IJ35 dimensional change. Swivel The actuator swivels Allows operation Inefficient coupling IJ06 around a central pivot. where the net linear to the ink motion This motion is suitable force on the paddle where there are is zero opposite forces Small chip area applied to opposite requirements sides of the paddle, e.g. Lorenz force. Straighten The actuator is Can be used with Requires careful IJ26, IJ32 normally bent, and shape memory balance of stresses straightens when alloys where the to ensure that the energized. austenitic phase is quiescent bend is planar accurate Double The actuator bends in One actuator can be Difficult to make IJ36, IJ37, IJ38 bend one direction when used to power two the drops ejected by one element is nozzles. both bend directions energized, and bends Reduced chip size. identical. the other way when Not sensitive to A small efficiency another element is ambient temperature loss compared to energized. equivalent single bend actuators. Shear Energizing the Can increase the Not readily 1985 Fishbeck U.S. Pat. No. actuator causes a shear effective travel of applicable to other 4,584,590 motion in the actuator piezoelectric actuator material. actuators mechanisms Radial constriction The actuator squeezes Relatively easy to High force required 1970 Zoltan U.S. Pat. No. an ink reservoir, fabricate single Inefficient 3,683,212 forcing ink from a nozzles from glass Difficult to integrate constricted nozzle. tubing as with VLSI macroscopic processes structures Coil/uncoil A coiled actuator Easy to fabricate as Difficult to fabricate IJ17, IJ21, IJ34, uncoils or coils more a planar VLSI for non-planar IJ35 tightly. The motion of process devices the free end of the Small area required, Poor out-of-plane actuator ejects the ink. therefore low cost stiffness Bow The actuator bows (or Can increase the Maximum travel is IJ16, IJ18, IJ27 buckles) in the middle speed of travel constrained when energized. Mechanically rigid High force required Push-Pull Two actuators control The structure is Not readily suitable IJ18 a shutter. One actuator pinned at both ends, for ink jets which pulls the shutter, and so has a high out-of- directly push the ink the other pushes it. plane rigidity Curl A set of actuators curl Good fluid flow to Design complexity IJ20, IJ42 inwards inwards to reduce the the region behind volume of ink that the actuator they enclose. increases efficiency Curl A set of actuators curl Relatively simple Relatively large IJ43 outwards outwards, pressurizing construction chip area ink in a chamber surrounding the actuators, and expelling ink from a nozzle in the chamber. Iris Multiple vanes enclose High efficiency High fabrication IJ22 a volume of ink. These Small chip area complexity simultaneously rotate, Not suitable for reducing the volume pigmented inks between the vanes. Acoustic The actuator vibrates The actuator can be Large area required 1993 Hadimioglu et al, vibration at a high frequency. physically distant for efficient EUP 550,192 from the ink operation at useful 1993 Elrod et al, frequencies EUP 572,220 Acoustic coupling and crosstalk Complex drive circuitry Poor control of drop volume and position None In various ink jet No moving parts Various other Silverbrook, EP designs the actuator tradeoffs are 0771 658 A2 and does not move. required to related patent eliminate moving applications parts Tone-jet

NOZZLE REFILL METHOD Description Advantages Disadvantages Examples Surface This is the normal way Fabrication Low speed Thermal ink jet tension that ink jets are simplicity Surface tension Piezoelectric ink jet refilled. After the Operational force relatively IJ01-IJ07, IJ10-IJ14, actuator is energized, simplicity small compared to IJ16, IJ20, IJ22-IJ45 it typically returns actuator force rapidly to its normal Long refill time position. This rapid usually dominates return sucks in air the total repetition through the nozzle rate opening. The ink surface tension at the nozzle then exerts a small force restoring the meniscus to a minimum area. This force refills the nozzle. Shuttered Ink to the nozzle High speed Requires common IJ08, IJ13, IJ15, oscillating chamber is provided at Low actuator ink pressure IJ17, IJ18, IJ19, ink pressure a pressure that energy, as the oscillator IJ21 oscillates at twice the actuator need only May not be suitable drop ejection open or close the for pigmented inks frequency. When a shutter, instead of drop is to be ejected, ejecting the ink drop the shutter is opened for 3 half cycles: drop ejection, actuator return, and refill. The shutter is then closed to prevent the nozzle chamber emptying during the next negative pressure cycle. Refill After the main High speed, as the Requires two IJ09 actuator actuator has ejected a nozzle is actively independent drop a second (refill) refilled actuators per nozzle actuator is energized. The refill actuator pushes ink into the nozzle chamber. The refill actuator returns slowly, to prevent its return from emptying the chamber again. Positive ink The ink is held a slight High refill rate, Surface spill must Silverbrook, EP pressure positive pressure. therefore a high be prevented 0771 658 A2 and After the ink drop is drop repetition rate Highly hydrophobic related patent ejected, the nozzle is possible print head surfaces applications chamber fills quickly are required Alternative for:, as surface tension and IJ01-IJ07, IJ10-IJ14, ink pressure both IJ16, IJ20, IJ22-IJ45 operate to refill the nozzle.

METHOD OF RESTRICTING BACK-FLOW THROUGH INLET Description Advantages Disadvantages Examples Long inlet The ink inlet channel Design simplicity Restricts refill rate Thermal ink jet channel to the nozzle chamber Operational May result in a Piezoelectric ink jet is made long and simplicity relatively large chip IJ42, IJ43 relatively narrow, Reduces crosstalk area relying on viscous Only partially drag to reduce inlet effective back-flow. Positive ink The ink is under a Drop selection and Requires a method Silverbrook, EP pressure positive pressure, so separation forces (such as a nozzle 0771 658 A2 and that in the quiescent can be reduced rim or effective related patent state some of the ink Fast refill time hydrophobizing, or applications drop already protrudes both) to prevent Possible operation from the nozzle. flooding of the of the following: This reduces the ejection surface of IJ01-IJ07, IJ09-IJ12, pressure in the nozzle the print head. IJ14, IJ16, chamber which is IJ20, IJ22,, IJ23-IJ34, required to eject a IJ36-IJ41, IJ44 certain volume of ink. The reduction in chamber pressure results in a reduction in ink pushed out through the inlet. Baffle One or more baffles The refill rate is not Design complexity HP Thermal Ink Jet are placed in the inlet as restricted as the May increase Tektronix ink flow. When the long inlet method. fabrication piezoelectric ink jet actuator is energized, Reduces crosstalk complexity (e.g. the rapid ink Tektronix hot melt movement creates Piezoelectric print eddies which restrict heads). the flow through the inlet. The slower refill process is unrestricted, and does not result in eddies. Flexible flap In this method recently Significantly Not applicable to Canon restricts disclosed by Canon, reduces back-flow most ink jet inlet the expanding actuator for edge-shooter configurations (bubble) pushes on a thermal ink jet Increased flexible flap that devices fabrication restricts the inlet. complexity Inelastic deformation of polymer flap results in creep over extended use Inlet filter A filter is located Additional Restricts refill rate IJ04, IJ12, IJ24, between the ink inlet advantage of ink May result in IJ27, IJ29, IJ30 and the nozzle filtration complex chamber. The filter Ink filter may be construction has a multitude of fabricated with no small holes or slots, additional process restricting ink flow. steps The filter also removes particles which may block the nozzle. Small inlet The ink inlet channel Design simplicity Restricts refill rate IJ02, IJ37, IJ44 compared to the nozzle chamber May result in a to nozzle has a substantially relatively large chip smaller cross section area than that of the nozzle, Only partially resulting in easier ink effective egress out of the nozzle than out of the inlet. Inlet shutter A secondary actuator Increases speed of Requires separate IJ09 controls the position of the ink-jet print refill actuator and a shutter, closing off head operation drive circuit the ink inlet when the main actuator is energized. The inlet is The method avoids the Back-flow problem Requires careful IJ01, IJ03, IJ05, located problem of inlet back- is eliminated design to minimize IJ06, IJ07, IJ10, behind the flow by arranging the the negative IJ11, IJ14, IJ16, ink-pushing ink-pushing surface of pressure behind the IJ22, IJ23, IJ25, surface the actuator between paddle IJ28, IJ31, IJ32, the inlet and the IJ33, IJ34, IJ35, nozzle. IJ36, IJ39, IJ40, IJ41 Part of the The actuator and a Significant Small increase in IJ07, IJ20, IJ26, actuator wall of the ink reductions in back- fabrication IJ38 moves to chamber are arranged flow can be complexity shut off the so that the motion of achieved inlet the actuator closes off Compact designs the inlet. possible Nozzle In some configurations Ink back-flow None related to ink Silverbrook, EP actuator of ink jet, there is no problem is back-flow on 0771 658 A2 and does not expansion or eliminated actuation related patent result in ink movement of an applications back-flow actuator which may Valve-jet cause ink back-flow Tone-jet through the inlet.

NOZZLE CLEARING METHOD Description Advantages Disadvantages Examples Normal All of the nozzles are No added May not be Most ink jet systems nozzle firing fired periodically, complexity on the sufficient to IJ01, IJ02, IJ03, before the ink has a print head displace dried ink IJ04, IJ05, IJ06, chance to dry. When IJ07, IJ09, IJ10, not in use the nozzles IJ11, IJ12, IJ14, are sealed (capped) IJ16, IJ20, IJ22, against air. IJ23, IJ24, IJ25, The nozzle firing is IJ26, IJ27, IJ28, usually performed IJ29, IJ30, IJ31, during a special IJ32, IJ33, IJ34, clearing cycle, after IJ36, IJ37, IJ38, first moving the print IJ39, IJ40, IJ41, head to a cleaning IJ42, IJ43, IJ44, station. IJ45 Extra In systems which heat Can be highly Requires higher Silverbrook, EP power to the ink, but do not boil effective if the drive voltage for 0771 658 A2 and ink heater it under normal heater is adjacent to clearing related patent situations, nozzle the nozzle May require larger applications clearing can be drive transistors achieved by over- powering the heater and boiling ink at the nozzle. Rapid The actuator is fired in Does not require Effectiveness May be used with: succession rapid succession. In extra drive circuits depends IJ01, IJ02, IJ03, of actuator some configurations, on the print head substantially upon IJ04, IJ05, IJ06, pulses this may cause heat Can be readily the configuration of IJ07, IJ09, IJ10, build-up at the nozzle controlled and the ink jet nozzle IJ11, IJ14, IJ16, which boils the ink, initiated by digital IJ20, IJ22, IJ23, clearing the nozzle. In logic IJ24, IJ25, IJ27, other situations, it may IJ28, IJ29, IJ30, cause sufficient IJ31, IJ32, IJ33, vibrations to dislodge IJ34, IJ36, IJ37, clogged nozzles. IJ38, IJ39, IJ40, IJ41, IJ42, IJ43, IJ44, IJ45 Extra Where an actuator is A simple solution Not suitable where May be used with: power to not normally driven to where applicable there is a hard limit IJ03, IJ09, IJ16, ink pushing the limit of its motion, to actuator IJ20, IJ23, IJ24, actuator nozzle clearing may be movement IJ25, IJ27, IJ29, assisted by providing IJ30, IJ31, IJ32, an enhanced drive IJ39, IJ40, IJ41, signal to the actuator. IJ42, IJ43, IJ44, IJ45 Acoustic An ultrasonic wave is A high nozzle High IJ08, IJ13, IJ15, resonance applied to the ink clearing capability implementation cost IJ17, IJ18, IJ19, chamber. This wave is can be achieved if system does not IJ21 of an appropriate May be already include an amplitude and implemented at very acoustic actuator frequency to cause low cost in systems sufficient force at the which already nozzle to clear include acoustic blockages. This is actuators easiest to achieve if the ultrasonic wave is at a resonant frequency of the ink cavity. Nozzle A microfabricated Can clear severely Accurate Silverbrook, EP clearing plate is pushed against clogged nozzles mechanical 0771 658 A2 and plate the nozzles. The plate alignment is related patent has a post for every required applications nozzle. A post moves Moving parts are through each nozzle, required displacing dried ink. There is risk of damage to the nozzles Accurate fabrication is required Ink The pressure of the ink May be effective Requires pressure May be used with pressure is temporarily where other pump or other all IJ series ink jets pulse increased so that ink methods cannot be pressure actuator streams from all of the used Expensive nozzles. This may be Wasteful of ink used in conjunction with actuator energizing. Print head A flexible ‘blade’ is Effective for planar Difficult to use if Many ink jet wiper wiped across the print print head surfaces print head surface is systems head surface. The Low cost non-planar or very blade is usually fragile fabricated from a Requires flexible polymer, e.g. mechanical parts rubber or synthetic Blade can wear out elastomer. in high volume print systems Separate A separate heater is Can be effective Fabrication Can be used with ink boiling provided at the nozzle where other nozzle complexity many IJ series ink heater although the normal clearing methods jets drop ejection cannot be used mechanism does not Can be implemented require it. The heaters at no additional cost do not require in some ink jet individual drive configurations circuits, as many nozzles can be cleared simultaneously, and no imaging is required.

NOZZLE PLATE CONSTRUCTION Description Advantages Disadvantages Examples Electroformed A nozzle plate is Fabrication High temperatures Hewlett Packard nickel separately fabricated simplicity and pressures are Thermal Ink jet from electroformed required to bond nickel, and bonded to nozzle plate the print head chip. Minimum thickness constraints Differential thermal expansion Laser Individual nozzle No masks required Each hole must be Canon Bubblejet ablated or holes are ablated by an Can be quite fast individually formed 1988 Sercel et al., drilled intense UV laser in a Some control over Special equipment SPIE, Vol. 998 polymer nozzle plate, which is nozzle profile is required Excimer Beam typically a polymer possible Slow where there Applications, pp. such as polyimide or Equipment required are many thousands 76-83 polysulphone is relatively low cost of nozzles per print 1993 Watanabe et al., head U.S. Pat. No. 5,208,604 May produce thin burrs at exit holes Silicon A separate nozzle High accuracy is Two part K. Bean, IEEE micromachined plate is attainable construction Transactions on micromachined from High cost Electron Devices, single crystal silicon, Requires precision Vol. ED-25, No. 10, and bonded to the alignment 1978, pp 1185-1195 print head wafer. Nozzles may be Xerox 1990 clogged by adhesive Hawkins et al., U.S. Pat. No. 4,899,181 Glass Fine glass capillaries No expensive Very small nozzle 1970 Zoltan U.S. Pat. No. capillaries are drawn from glass equipment required sizes are difficult to 3,683,212 tubing. This method Simple to make form has been used for single nozzles Not suited for mass making individual production nozzles, but is difficult to use for bulk manufacturing of print heads with thousands of nozzles. Monolithic, The nozzle plate is High accuracy (<1 μm) Requires sacrificial Silverbrook, EP surface deposited as a layer Monolithic layer under the 0771 658 A2 and micromachined using standard VLSI Low cost nozzle plate to form related patent using VLSI deposition techniques. Existing processes the nozzle chamber applications lithographic Nozzles are etched in can be used Surface may be IJ01, IJ02, IJ04, processes the nozzle plate using fragile to the touch IJ11, IJ12, IJ17, VLSI lithography and IJ18, IJ20, IJ22, etching. IJ24, IJ27, IJ28, IJ29, IJ30, IJ31, IJ32, IJ33, IJ34, IJ36, IJ37, IJ38, IJ39, IJ40, IJ41, IJ42, IJ43, IJ44 Monolithic, The nozzle plate is a High accuracy (<1 μm) Requires long etch IJ03, IJ05, IJ06, etched buried etch stop in the Monolithic times IJ07, IJ08, IJ09, through wafer. Nozzle Low cost Requires a support IJ10, IJ13, IJ14, substrate chambers are etched in No differential wafer IJ15, IJ16, IJ19, the front of the wafer, expansion IJ21, IJ23, IJ25, and the wafer is IJ26 thinned from the backside. Nozzles are then etched in the etch stop layer. No nozzle Various methods have No nozzles to Difficult to control Ricoh 1995 Sekiya et al plate been tried to eliminate become clogged drop position U.S. Pat. No. 5,412,413 the nozzles entirely, to accurately 1993 Hadimioglu et al prevent nozzle Crosstalk problems EUP 550,192 clogging. These 1993 Elrod et al include thermal bubble EUP 572,220 mechanisms and acoustic lens mechanisms Trough Each drop ejector has Reduced Drop firing IJ35 a trough through manufacturing direction is sensitive which a paddle moves. complexity to wicking. There is no nozzle Monolithic plate. Nozzle slit The elimination of No nozzles to Difficult to control 1989 Saito et al instead of nozzle holes and become clogged drop position U.S. Pat. No. 4,799,068 individual replacement by a slit accurately nozzles encompassing many Crosstalk problems actuator positions reduces nozzle clogging, but increases crosstalk due to ink surface waves

DROP EJECTION DIRECTION Description Advantages Disadvantages Examples Edge Ink flow is along the Simple construction Nozzles limited to Canon Bubblejet (‘edge surface of the chip, No silicon etching edge 1979 Endo et al GB shooter’) and ink drops are required High resolution is patent 2,007,162 ejected from the chip Good heat sinking difficult Xerox heater-in-pit edge. via substrate Fast color printing 1990 Hawkins et al Mechanically strong requires one print U.S. Pat. No. 4,899,181 Ease of chip head per color Tone-jet handing Surface Ink flow is along the No bulk silicon Maximum ink flow Hewlett-Packard TIJ (‘roof surface of the chip, etching required is severely restricted 1982 Vaught et al shooter’) and ink drops are Silicon can make an U.S. Pat. No. 4,490,728 ejected from the chip effective heat sink IJ02, IJ11, IJ12, surface, normal to the Mechanical strength IJ20, IJ22 plane of the chip. Through Ink flow is through the High ink flow Requires bulk Silverbrook, EP chip, chip, and ink drops are Suitable for silicon etching 0771 658 A2 and forward ejected from the front pagewidth print related patent (‘up surface of the chip. heads applications shooter’) High nozzle packing IJ04, IJ17, IJ18, density therefore IJ24, IJ27-IJ45 low manufacturing cost Through Ink flow is through the High ink flow Requires wafer IJ01, IJ03, IJ05, chip, chip, and ink drops are Suitable for thinning IJ06, IJ07, IJ08, reverse ejected from the rear pagewidth print Requires special IJ09, IJ10, IJ13, (‘down surface of the chip. heads handling during IJ14, IJ15, IJ16, shooter’) High nozzle packing manufacture IJ19, IJ21, IJ23, density therefore IJ25, IJ26 low manufacturing cost Through Ink flow is through the Suitable for Pagewidth print Epson Stylus actuator actuator, which is not piezoelectric print heads require Tektronix hot melt fabricated as part of heads several thousand piezoelectric ink jets the same substrate as connections to drive the drive transistors. circuits Cannot be manufactured in standard CMOS fabs Complex assembly required

INK TYPE Description Advantages Disadvantages Examples Aqueous, Water based ink which Environmentally Slow drying Most existing ink dye typically contains: friendly Corrosive jets water, dye, surfactant, No odor Bleeds on paper All IJ series ink jets humectant, and May strikethrough Silverbrook, EP biocide. Cockles paper 0771 658 A2 and Modern ink dyes have related patent high water-fastness, applications light fastness Aqueous, Water based ink which Environmentally Slow drying IJ02, IJ04, IJ21, pigment typically contains: friendly Corrosive IJ26, IJ27, IJ30 water, pigment, No odor Pigment may clog Silverbrook, EP surfactant, humectant, Reduced bleed nozzles 0771 658 A2 and and biocide. Reduced wicking Pigment may clog related patent Pigments have an Reduced actuator applications advantage in reduced strikethrough mechanisms Piezoelectric ink- bleed, wicking and Cockles paper jets strikethrough. Thermal ink jets (with significant restrictions) Methyl MEK is a highly Very fast drying Odorous All IJ series ink jets Ethyl volatile solvent used Prints on various Flammable Ketone for industrial printing substrates such as (MEK) on difficult surfaces metals and plastics such as aluminum cans. Alcohol Alcohol based inks Fast drying Slight odor All IJ series ink jets (ethanol, can be used where the Operates at sub- Flammable 2-butanol, printer must operate at freezing and others) temperatures below temperatures the freezing point of Reduced paper water. An example of cockle this is in-camera Low cost consumer photographic printing. Phase The ink is solid at No drying time - ink High viscosity Tektronix hot melt change room temperature, and instantly freezes on Printed ink typically piezoelectric ink jets (hot melt) is melted in the print the print medium has a ‘waxy’ feel 1989 Nowak U.S. Pat. No. head before jetting. Almost any print Printed pages may 4,820,346 Hot melt inks are medium can be used ‘block’ All IJ series ink jets usually wax based, No paper cockle Ink temperature with a melting point occurs may be above the around 80° C. After No wicking occurs curie point of jetting the ink freezes No bleed occurs permanent magnets almost instantly upon No strikethrough Ink heaters consume contacting the print occurs power medium or a transfer Long warm-up time roller. Oil Oil based inks are High solubility High viscosity: this All IJ series ink jets extensively used in medium for some is a significant offset printing. They dyes limitation for use in have advantages in Does not cockle ink jets, which improved paper usually require a characteristics on Does not wick low viscosity. Some paper (especially no through paper short chain and wicking or cockle). multi-branched oils Oil soluble dies and have a sufficiently pigments are required. low viscosity. Slow drying Microemulsion A microemulsion is a Stops ink bleed Viscosity higher All IJ series ink jets stable, self forming High dye solubility than water emulsion of oil, water, Water, oil, and Cost is slightly and surfactant. The amphiphilic soluble higher than water characteristic drop size dies can be used based ink is less than 100 nm, Can stabilize High surfactant and is determined by pigment concentration the preferred curvature suspensions required (around of the surfactant. 5%) 

1. A nozzle arrangement for an inkjet printer, the nozzle arrangement comprising: a wafer assembly defining a nozzle chamber into which ink can be fed; a nozzle chamber roof assembly fast with the wafer assembly and covering the nozzle chamber, the nozzle chamber roof assembly defining an ink ejection port supported by a plurality of outwardly extending bridging members, and a plurality of cantilevered actuators interleaved between the bridging members and extending inwardly to terminate in free ends proximal to the ink ejection port; and an elongate heater element which extends through each actuator so that, in use, the heater element causes differential thermal expansion in the actuators and thus the free ends of the actuators subsequently to move into the nozzle chamber and force ink therein out through the ink ejection port.
 2. A nozzle arrangement as claimed in claim 1, wherein the heater element is arranged to be generally circular and comprises a plurality of spaced apart serpentine stations extending radially inwardly.
 3. A nozzle arrangement as claimed in claim 2, wherein each serpentine station is symmetric and comprises a mirrored pair of serpentine portions.
 4. A nozzle arrangement as claimed in claim 1, wherein the ends of the heater element terminate in a pair of vias which are connected to a metal layer of the wafer assembly.
 5. A nozzle arrangement as claimed in claim 1, wherein the nozzle chamber is generally funnel-shaped and tapers inwardly away from the cover.
 6. A nozzle arrangement as claimed in claim 5, wherein the wafer assembly further defines an ink supply inlet at an apex of the tapered nozzle chamber, the ink supply inlet being substantially aligned with the ink ejection port.
 7. A nozzle arrangement as claimed in claim 1, wherein each actuator comprises a stem containing the heater element and which terminates in an enlarged free end.
 8. A nozzle arrangement as claimed in claim 1, wherein each bridging member defines an ink flow guide rail to inhibit wicking of ink on the actuators. 